Description
In addition to being the most price-performance product in the market, they are intermediate component products that support high-density excellent cooling with a heat transfer coefficient of 8.5W/mK that provides heat transfer between the processor and the heatsink. It acts as an intermediate component that provides the most effective and efficient cooling by quickly transmitting the heat it receives from your CPU, GPU or motherboard chipset to your cooler. In cooling solutions, you can use thermal pastes, which do not only appeal to professionals, in your Notebook or in your graphics card or other hardware. Our putties are the best thermal conduction product on the market, proving that excellent performance does not require high prices.
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